Signal integrity (SI)

HyperLynx® is a combination of powerful 2D, 2.5D and 3D Full-wave solvers as well as geometric converters and simulators to achieve the most accurate results in the shortest possible time through bi-directional integration in Xpedition and an intuitive interface. You have access to the most demanded types of analysis even without special training: the use of wizards for the most common protocols makes the engineer's tasks much easier.

Supports Altium® Designer, OrCAD, Allegro and CADSTAR projects.

Power Integrity (PI)

Similar to signal integrity analysis, power integrity analysis is performed by decomposing the power domains. HyperLynx tools allow you to identify areas of excessive voltage drop, excessive current density, optimized filter capacitor selection and placement, and the presence of voltage ripple.

PCB Thermal Analysis

HyperLynx® Thermal analyzes thermal conditions on a composed, partially or fully traced board. The tool simulates conductivity, convection, and radiation, and creates temperature profiles, gradients, and superheat maps to help optimize board and component selection early in the design process.

Sign-off verification

Sign-off verification is a task that is handled by the HyperLynx® DRC tool. Traditionally, this kind of verification is done by a human, which increases the chance of missing errors regarding optimal retu current paths, reference polygon integrity, potential noise sources, etc. The HyperLynx® DRC reduces testing time to minutes, identifies critical errors and tells you how to fix them, and the ability to create your own rules expands your already huge set of checks.

Electromagnetic compatibility

The HyperLynx® Advanced Solvers 3D modeling technologies enable you to model and extract data for chip packaging and PCB optimization. Extraction of S/Z/Y-parameters, RLGC, IBIS models, current density, electromagnetic field plotting, loop inductance and capacitive/inductive coupling analysis.